Electronics Industry Water Treatment Equipment

Core Technologies and Equipment

The electronics industry has extremely high requirements for water quality, especially in fields such as semiconductor manufacturing and integrated circuits. The water must meet stringent indicators including resistivity ≥ 18MΩ・cm, particle count ≤ 0.1 particle/mL (for particles of 0.2μm), and TOC ≤ 5ppb. The mainstream equipment and technologies are as follows:

Reverse Osmosis (RO) + Electrodeionization (EDI) Combined Process

Reverse Osmosis (RO): High desalination rate membrane elements are used to remove over 99% of ions and organic substances, with the produced water having a conductivity ≤ 10μS/cm.

Electrodeionization (EDI)

 It drives ion migration through an electric field to continuously regenerate resins without the need for acid or alkali. The resistivity of the produced water can reach 16-18MΩ・cm, replacing traditional mixed beds. If the "RO + EDI + Polishing Mixed Bed" process is adopted, it can produce ultrapure water with a resistivity of 18.2MΩ・cm, meeting the needs of semiconductor chip manufacturing.

Ultrafiltration (UF) and Microfiltration (MF)

They are used for pretreatment to remove colloids, microorganisms, and macromolecular organic substances. For example, ceramic membranes have a filtration precision of 0.1-0.01μm, which can intercept bacteria and pyrogens, thus ensuring the service life of subsequent RO membranes.

Ultraviolet (UV) Sterilization and Ozone (O₃) Oxidation

Ultraviolet light with a wavelength of 254nm destroys the DNA of microorganisms and reduces TOC.

Ozone oxidizes and decomposes organic substances, and when used in conjunction with activated carbon adsorption, it ensures stable water quality.

Polishing Mixed Bed

As an end-stage treatment process, it further removes residual ions. The resistivity of the produced water can reach 18.2MΩ・cm, making it suitable for key processes such as photoresist preparation and wafer cleaning.